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Measurement in silicon wafer thickness in a lapping machine

Measurement in silicon wafer thickness in a lapping machine

General To lap the sliced silicon wafer to a certain level of the surface roughness, the GAP-SENSOR is mounted to the lapping machine that laps the wafer with the accuracy of ± 3μm.
Adoped sensor PU-05
Measurement of wafer thickness

Measurement of wafer thickness

General GAP-SENSOR is used to measure the thickness of the silicon wafer prepared by thinly slicing the silicon ingot.
The sensor detects the clearance between the upper and lower level base plates to calculate the wafer thickness.
While 05 coil type sensors are mainly used, 09 type products are occasionally used also.
The sensors are embedded into the upper base plate.
Adoped sensor PU-05