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Application examples |
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Measurement in silicon wafer thickness in a lapping
machine |
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| General |
To lap the sliced silicon
wafer to a certain level of the surface roughness, the GAP-SENSOR
is mounted to the lapping machine that laps the wafer with the accuracy
of ±3 µm. |
| Adoped sensor |
PU-05 |
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Measurement of wafer thickness |
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| General |
GAP-SENSOR is used to measure
the thickness of the silicon wafer prepared by thinly slicing the
silicon ingot.The sensor detects the clearance between the upper
and lower level base plates to calculate the wafer thickness. While
05 coil type sensors are mainly used, 09 type products are occasionally
used also. The sensors are embedded into the upper base plate. |
| Adoped sensor |
PU-05 |
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